GLOBAL FAN-OUT WAFER LEVEL PACKAGING MARKET 2018 BY MANUFACTURERS, COUNTRIES, TYPE AND APPLICATION, FORECAST TO 2023

Oct 2018 136

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Synopsis

FOWLP is a chip packaging technology that is used to package an IC, while the IC is still part of the wafer.

Scope of the Report:

This report studies the Fan-out Wafer Level Packaging market status and outlook of Global and major regions, from angles of players, countries, product types and end industries; this report analyzes the top players in global market, and splits the Fan-out Wafer Level Packaging market by product type and applications/end industries.

In terms of geography, APAC led the global FOWLP market. According to analysts, the region will continue to dominate this market during the forecast period as well and this will mainly attribute to the presence of major semiconductor industries in the region.

The global Fan-out Wafer Level Packaging market is valued at xx million USD in 2017 and is expected to reach xx million USD by the end of 2023, growing at a CAGR of xx% between 2017 and 2023.

The Asia-Pacific will occupy for more market share in following years, especially in China, also fast growing India and Southeast Asia regions.

North America, especially The United States, will still play an important role which cannot be ignored. Any changes from United States might affect the development trend of Fan-out Wafer Level Packaging.

Europe also play important roles in global market, with market size of xx million USD in 2017 and will be xx million USD in 2023, with a CAGR of xx%.

Market Segment by Companies, this report covers
- STATS ChipPAC
- TSMC
- Texas Instruments
- Rudolph Technologies
- SEMES
- SUSS MicroTec
- STMicroelectronics
- Ultratech

Market Segment by Regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia and Italy)

Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

South America (Brazil, Argentina, Colombia)

Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
- 200mm Wafer Level Packaging
- 300mm Wafer Level Packaging
- Other

Market Segment by Applications, can be divided into
- CMOS Image Sensor
- Wireless Connectivity
- Logic and Memory IC
- MEMS and Sensor
- Analog and Mixed IC
- Other

Table of Contents

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GLOBAL FAN-OUT WAFER LEVEL PACKAGING MARKET 2018 BY MANUFACTURERS, COUNTRIES, TYPE AND APPLICATION, FORECAST TO 2023

Global Info Research

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