GLOBAL FAN-IN WAFER LEVEL PACKAGING MARKET 2018 BY MANUFACTURERS, COUNTRIES, TYPE AND APPLICATION, FORECAST TO 2023

Oct 2018 133

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Synopsis

Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.

Scope of the Report:

This report studies the Fan-in Wafer Level Packaging market status and outlook of Global and major regions, from angles of players, countries, product types and end industries; this report analyzes the top players in global market, and splits the Fan-in Wafer Level Packaging market by product type and applications/end industries.

The analog and mixed IC segment accounted for the major shares and dominated the market. The demand for analog ICs from different segments such as consumer electronics, communications, and automotive and the increasing adoption of smartphones, phablets, and tablets, will fuel the growth of the market segment in the coming years. Additionally, technological advancements in the semiconductor industry that demand the need to ensure the robust performance of advanced ICs will also drive the demand for fan-in WLP packaging.

In terms of geographical regions, APAC will be the major revenue contributor to the market throughout the next few years. This is mainly due to the presence of a number of semiconductor foundries in this region. Moreover, the rise in demand for semiconductor devices due to the presence of prominent consumer electronics manufacturers, such as Samsung, Sony, LG, Toshiba, and Panasonic, will also bolster this market’s growth prospects.

The global Fan-in Wafer Level Packaging market is valued at xx million USD in 2017 and is expected to reach xx million USD by the end of 2023, growing at a CAGR of xx% between 2017 and 2023.

The Asia-Pacific will occupy for more market share in following years, especially in China, also fast growing India and Southeast Asia regions.

North America, especially The United States, will still play an important role which cannot be ignored. Any changes from United States might affect the development trend of Fan-in Wafer Level Packaging.

Europe also play important roles in global market, with market size of xx million USD in 2017 and will be xx million USD in 2023, with a CAGR of xx%.

Market Segment by Companies, this report covers
- STATS ChipPAC
- STMicroelectronics
- TSMC
- Texas Instruments
- Rudolph Technologies
- SEMES
- SUSS MicroTec
- Ultratech
- FlipChip International

Market Segment by Regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia and Italy)

Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

South America (Brazil, Argentina, Colombia)

Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
- 200mm Wafer Level Packaging
- 300mm Wafer Level Packaging
- Other

Market Segment by Applications, can be divided into
- CMOS Image Sensor
- Wireless Connectivity
- Logic and Memory IC
- MEMS and Sensor
- Analog and Mixed IC
- Other

Table of Contents

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GLOBAL FAN-IN WAFER LEVEL PACKAGING MARKET 2018 BY MANUFACTURERS, COUNTRIES, TYPE AND APPLICATION, FORECAST TO 2023

Global Info Research

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