GLOBAL WAFER LEVEL PACKAGING MARKET BY MANUFACTURERS, REGIONS, TYPE AND APPLICATION, FORECAST TO 2023

Oct 2018 148

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Synopsis

Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.[1] Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.

Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing.

There is no single industry-standard method of wafer-level packaging at present.

A major application area of WLPs are smartphones due to the size constraints.

Scope of the Report:

This report focuses on the Wafer Level Packaging in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

The worldwide market for Wafer Level Packaging is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.

Market Segment by Manufacturers, this report covers
- Amkor Technology Inc
- Fujitsu Ltd
- Jiangsu Changjiang Electronics
- Deca Technologies
- Qualcomm Inc
- Toshiba Corp
- Tokyo Electron Ltd
- Applied Materials, Inc
- ASML Holding NV
- Lam Research Corp
- KLA-Tencor Corration
- China Wafer Level CSP Co. Ltd
- Marvell Technology Group Ltd
- Siliconware Precision Industries
- Nanium SA
- STATS Chip
- PAC Ltd

Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
- 3D TSV WLP
- 2.5D TSV WLP
- WLCSP
- Nano WLP
- Others ( 2D TSV WLP and Compliant WLP)

Market Segment by Applications, can be divided into
- Electronics
- IT & Telecommunication
- Industrial
- Automotive
- Aerospace & Defense
- Healthcare
- Others (Media & Entertainment and Non-Conventional Energy Resources)

There are 15 Chapters to deeply display the global Wafer Level Packaging market.

Chapter 1, to describe Wafer Level Packaging Introduction, product scope, market overview, market opportunities, market risk, market driving force;

Chapter 2, to analyze the top manufacturers of Wafer Level Packaging, with sales, revenue, and price of Wafer Level Packaging, in 2016 and 2017;

Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;

Chapter 4, to show the global market by regions, with sales, revenue and market share of Wafer Level Packaging, for each region, from 2013 to 2018;

Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;

Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;

Chapter 12, Wafer Level Packaging market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;

Chapter 13, 14 and 15, to describe Wafer Level Packaging sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

Table of Contents

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GLOBAL WAFER LEVEL PACKAGING MARKET BY MANUFACTURERS, REGIONS, TYPE AND APPLICATION, FORECAST TO 2023

Global Info Research

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