GLOBAL BONDING WIRES MARKET 2018 BY MANUFACTURERS, REGIONS, TYPE AND APPLICATION, FORECAST TO 2023

Sep 2018 128

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Synopsis

Bonding wire is the material of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
Scope of the Report:
This report focuses on the Bonding Wires in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
The global market of Bonding Wires Industry is really scattered due to the wide application and consumption scale.
The price of Bonding Wires is slightly decreased in nearly five years. For being accorded with the corresponding application area, the product price has a large differences.
As large demand of Bonding Wires product, the domestic enterprises should hold the opportunity to improve their technology with domestic advantages, such as low raw material price.
The worldwide market for Bonding Wires is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
- Heraeus
- Tanaka
- Sumitomo Metal Mining
- MK Electron
- AMETEK
- Doublink Solders
- Yantai Zhaojin Kanfort
- Tatsuta Electric Wire & Cable
- Kangqiang Electronics
- The Prince & Izant
- Custom Chip Connections
- Yantai YesNo Electronic Materials
Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
- Gold Bonding Wire
- Copper Bonding Wire
- Silver Bonding Wire
- Palladium Coated Copper Bonding Wire
- Others
Market Segment by Applications, can be divided into
- IC
- Transistor
- Others
There are 15 Chapters to deeply display the global Bonding Wires market.
Chapter 1, to describe Bonding Wires Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Bonding Wires, with sales, revenue, and price of Bonding Wires, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Bonding Wires, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Bonding Wires market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Bonding Wires sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

Table of Contents

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GLOBAL BONDING WIRES MARKET 2018 BY MANUFACTURERS, REGIONS, TYPE AND APPLICATION, FORECAST TO 2023

Global Info Research

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