GLOBAL ADVANCED PACKAGING MARKET 2019 BY MANUFACTURERS, REGIONS, TYPE AND APPLICATION, FORECAST TO 2024

Apr 2019 138

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Synopsis

During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level, flip-chip, and through silicon via setups.

Scope of the Report:
The commercial reality for most integrated-circuit (IC) manufacturers is that node migrations and changes in wafer sizes are slowing down even as capital expenditures are increasing. One way for manufacturers to preserve their edge on their circuits’ small sizes, low costs, and high performance is to incorporate newer chip-packaging options such as 2.5-D integrated circuits (2.5DICs) and 3-D integrated circuits (3.0DICs) into their production processes. These advanced-packaging technologies, many of which are still in their infancy, promise greater chip connectivity and lower power consumption compared with traditional packaging configurations.
Meanwhile, advanced packaging has become a technology priority for the Chinese semiconductor industry, according to the high-level policy framework released by the State Council of the People’s Republic of China in June 2014. The council aims to have advanced packaging account for about 30 percent of all packaging revenues earned by Chinese vendors by 2015.
The worldwide market for Advanced Packaging is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2024, from xx million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Advanced Packaging in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers
- ASE
- Amkor
- SPIL
- Stats Chippac
- PTI
- JCET
- J-Devices
- UTAC
- Chipmos
- Chipbond
- STS
- Huatian
- NFM
- Carsem
- Walton
- Unisem
- OSE
- AOI
- Formosa
- NEPES

Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
- 3.0 DIC
- FO SIP
- FO WLP
- 3D WLP
- WLCSP
- 2.5D
- Filp Chip

Market Segment by Applications, can be divided into
- Automotives
- Computers
- Communications
- LED
- Healthcare
- Other

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Advanced Packaging product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Advanced Packaging, with price, sales, revenue and global market share of Advanced Packaging in 2017 and 2018.
Chapter 3, the Advanced Packaging competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Advanced Packaging breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Advanced Packaging market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Advanced Packaging sales channel, distributors, customers, research findings and conclusion, appendix and data source.

Table of Contents

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GLOBAL ADVANCED PACKAGING MARKET 2019 BY MANUFACTURERS, REGIONS, TYPE AND APPLICATION, FORECAST TO 2024

Global Info Research

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