GLOBAL BACK GRINDING TAPES MARKET 2019 BY MANUFACTURERS, REGIONS, TYPE AND APPLICATION, FORECAST TO 2024

Jan 2019 118

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Synopsis

BGT(Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.

Scope of the Report:
At present, the Back Grinding Tapes industry is generally at a more advanced level in Japan, the world's large enterprises are mainly concentrated in Japan. Meanwhile, Japan companies have more advanced equipment, strong R & D capability, the technical level is in a leading position.
There are major two classification of Back Grinding Tapes in this report, UV Type BGT, Non-UV Type BGT. Globally, the production value share of each type of Back Grinding Tapes is 40.46% and 59.54% in 2017.
The worldwide market for Back Grinding Tapes is expected to grow at a CAGR of roughly 4.9% over the next five years, will reach 230 million US$ in 2024, from 170 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Back Grinding Tapes in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers
- Mitsui Chemicals Tohcello
- Nitto
- LINTEC
- Furukawa Electric
- Denka
- D&X
- AI Technology

Market Segment by Regions, regional analysis covers
- North America (United States, Canada and Mexico)
- Europe (Germany, France, UK, Russia and Italy)
- Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
- South America (Brazil, Argentina, Colombia etc.)
- Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
- UV Type
- Non-UV Type

Market Segment by Applications, can be divided into
- Standard
- Standard Thin Die
- (S)DBG(GAL)
- Bump

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Back Grinding Tapes product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Back Grinding Tapes, with price, sales, revenue and global market share of Back Grinding Tapes in 2017 and 2018.
Chapter 3, the Back Grinding Tapes competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Back Grinding Tapes breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Back Grinding Tapes market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Back Grinding Tapes sales channel, distributors, customers, research findings and conclusion, appendix and data source.

Table of Contents

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GLOBAL BACK GRINDING TAPES MARKET 2019 BY MANUFACTURERS, REGIONS, TYPE AND APPLICATION, FORECAST TO 2024

Global Info Research

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